Automated soldering machines

Soldering machine design, automated ultrasonic soldering, automatic soldering machines
Automated soldering machines

Kuroda Techno is a pioneer of ultrasonic soldering systems with long experience in developing of special mechatronic solutions. Our engineering team is focused to provide excellent automation services in field of designing and building of sophisticated production equipment, not only limited to automated ultrasonic soldering. For example, fully automated manufacturing and inspection machines for hard disk drives productions.

We can offer soldering machine design for various industrial applications, however our main experience lies with the thin film photovoltaic industry. Kuroda Techno delivered numerous machines to famous Japanese module manufacturers and pv system integrators that took the advantage of high quality solder alloy Cerasolzer and Ceraribbon photovoltaic ribbon.

Basic soldering patterns

Ultrasonic soldering machines perform various tasks during its operations, however core soldering processes can be divided into 3 basic soldering patterns. Each soldering pattern has been formed to provide best soldering performance with given substrate or industrial field.

Point pre-soldering & point bonding
Flux-free two step bonding method, usually performed by two individual machines. Pre-soldering machine places Cerasolzer bumps in required distance on the substrate by using heat and ultrasonic oscillations. Coated component (e.g. ribbon) is placed over the pre-soldered area and bonded to by small pressure and heat, which remelts bumps and coating. Best joint performance is achieved with components coated by Cerasolzer, however standard Sn/Ag coating can be used.

Reference: ribbon soldering machine for a-Si pv modules (molybden back contact)

Line pre-soldering & line bonding
Flux-free two step bonding method, usually performed by two individual machines. Pre-soldering machine places base line of Cerasolzer on the substrate by employing heat and ultrasonic oscillations. In the second step, coated component (e.g. ribbon) is placed over the pre-soldered line and bonded to the substrate by using small pressure and heat, which remelts pre-soldered Cerasolzer line and coating of wire. We don't recommend using of standard Sn/Ag coating for this method, best joint performance is always achieved with materials coated with Cerasolzer.

Reference: ribbon soldering machine for CIGS pv modules (molybden back contact)

Direct soldering/bonding
Flux-free one step bonding method. Mainly used for electrode forming on glass or ceramic materials where soldering head directly draws electrode pattern with Cerasolzer by using heat and ultrasonic oscillations. Direct soldering of coated ribbons directly on glass substrates provides lower joint reliability and it is currently used in experimental productions only.

Reference: electrode forming machine for OLED display (glass substrate)

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