Electroformed stencils

Additive electroforming, smooth sidewalls, very fine stencil resolution, best paste release
Electroformed stencils

Electroformed stencils are made of nickel, by an additive electrochemical process. Photoresist is applied to a metal base plate and exposed through a photoplot to make a disposable aperture pattern. Electrolitic plating is then used to grow the nickel stencil around the apertures. After plating up nickel to the required thickness, the resist is removed and the electroformed stencil separated.

The advantage of electroformed stencil is the extreme smoothness of the aperture walls which results in easier flow of the paste into the aperture during printing and lower adhesion of the paste to the walls during release.

Due to its quality, these products can be used for screen printing of other materials than solder paste. Electroformed stencils are frequently used to print various adhesive layers, spacers to LCD touch panels, copper pastes in multi-layer semiconductor structures etc.?


Material nickel
Thickness 30µm ~ 300µm
Minimum pattern 0.8 x thickness
Opening cross-section stencil_cross_electroformed
Properties - sharp edges, less solder paste bleeding
- ultra-smooth sidewalls, exceptional paste release characteristics
- additive method, electroformed material
- expensive product
- up to 0.3mm pitch
Applications - high density layout printing, best paste release possible